Substrate processing apparatus and method of operating the same

ABSTRACT

Provided is a substrate processing apparatus in which parts are selectively lifted according to the purpose or subject of maintenance/repair during a maintenance/repair operation. The substrate processing apparatus includes: a chamber; a first cover and a second cover on the chamber; a lifting device connected to the first cover and configured to raise and lower the first cover; and a connection region. When the lifting device and the second cover are connected to each other via the connection region or the first and second covers are connected to each other via the connection region, the first and second covers are raised and lowered by the lifting device.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Korean Patent Application No.10-2016-0096121, filed on Jul. 28, 2016, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein in itsentirety by reference.

BACKGROUND 1. Field

One or more embodiments relate to a substrate processing apparatus, andmore particularly, to a substrate processing apparatus configured to beeasily maintained and repaired, and a method of operating the substrateprocessing apparatus (such as a method of maintaining and repairing thesubstrate processing apparatus).

2. Description of the Related Art

Various processing apparatuses have been developed for processingsubstrates such as semiconductor substrates or display substrates.Single-type processing apparatuses configured to process substrates oneby one had been widely used in early days, and then processingapparatuses configured to process a plurality of substrates at a time toincrease productivity per unit time have been developed. For example,vertical batch type reactors capable of simultaneously processingseveral tens of substrates vertically stacked therein have been used.

In addition, horizontal batch type multiple substrate processingapparatuses configured to simultaneously process a plurality ofsubstrates by processing each substrate like the existing single-typeprocessing apparatuses have been recently widely used. Since horizontalbatch type multiple substrate processing apparatuses are capable ofsimultaneously processing a plurality of substrates and preciselycontrolling each substrate, the application of horizontal batch typemultiple substrate processing apparatuses has been gradually increased.

SUMMARY

One or more embodiments include a substrate processing apparatus (suchas a semiconductor substrate deposition apparatus) configured tosimultaneously process a plurality of substrates in an efficient andsafe manner, and a method of maintaining and repairing the substrateprocessing apparatus.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to one or more embodiments, a substrate processing apparatusincludes: a chamber; a first cover and a second cover on the chamber; alifting device connected to the first cover and configured to raise andlower the first cover; and a connection region, wherein when the liftingdevice and the second cover are connected to each other via theconnection region or the first and second covers are connected to eachother via the connection region, the first and second covers are raisedand lowered by the lifting device.

The substrate processing apparatus may be a horizontal batch typesubstrate processing apparatus capable of simultaneously processing aplurality of substrates, and at least one of the first and second coversmay include a plurality of accommodation regions accommodating aplurality of substrates.

The substrate processing apparatus may further include: a firstsupporting part connected to the first cover; and a second supportingpart connected to the second cover, wherein the connection region may beformed in at least one of the first and second supporting parts.

The connection region may be formed by a first region of the firstsupporting part and a second region of the second supporting part.

The substrate processing apparatus may further include an insertionmember inserted into the connection region.

The first cover and the second cover may be mechanically connected toeach other by the insertion member, and the first and second covers maybe raised and lowered by the lifting device.

The first cover may include a processing unit (such as a showerheadassembly). The second cover may include a reaction wall. The secondcover may further include an exhaust path.

According to one or more embodiments, a substrate processing apparatusincludes: a frame; a chamber disposed on the frame; and at least onelifting device, wherein the chamber includes: a lower chamber includingat least one substrate mounting unit; and a top lid unit including atleast one gas supply unit, wherein the lifting device is connected tothe top lid unit.

The top lid unit may include: a showerhead plate; and a top lid plate.

The substrate processing apparatus may further include: a showerheadplate supporting block; and a top lid plate supporting block.

The showerhead plate supporting block may be connected between theshowerhead plate and a cylinder of the lifting device, and the top lidplate supporting block may be connected to the top lid plate.

At least two insertion regions may be formed between the showerheadplate supporting block and the top lid plate supporting block.

Inserts may be inserted into the insertion regions.

The lifting device may include a cylinder.

The cylinder may be configured to lift the top lid unit using airpressure, hydraulic pressure, or elastic force.

According to one or more embodiments, a method of operating a substrateprocessing apparatus includes: increasing an inside pressure of achamber to a level equal to an outside pressure of the chamber; andlifting at least one of a first cover and a second cover disposed on thechamber, wherein the lifting of at least one of the first cover and thesecond cover is performed as follows: the first cover is lifted and thesecond cover is in contact with the chamber in a first mode, and thefirst cover and the second cover are lifted in a second mode.

According to one or more embodiments, a method of maintaining andrepairing a substrate processing apparatus includes: increasing aninside pressure of a chamber to a level equal to an outside pressure ofthe chamber; inserting inserts into insertion regions formed between ashowerhead plate supporting block and top lid plate supporting block;lifting a cylinder connected to the showerhead plate supporting block;and lifting a showerhead plate and a top lid plate together.

According to one or more embodiments, a method of maintaining andrepairing a substrate processing apparatus includes: increasing aninside pressure of a chamber to a level equal to an outside pressure ofthe chamber; not inserting inserts into insertion regions formed betweena showerhead plate supporting block and top lid plate supporting block;lifting a cylinder connected to the showerhead plate supporting block;and lifting only a showerhead plate separately from a top lid plate.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readilyappreciated from the following description of the embodiments, taken inconjunction with the accompanying drawings in which:

FIG. 1 is a schematic cross-sectional view illustrating a substrateprocessing apparatus according to an embodiment;

FIGS. 2 and 3 are views illustrating the substrate processing apparatusdepicted FIG. 1 when a first cover and/or a second cover of thesubstrate processing apparatus are/is lifted;

FIG. 4 is a schematic cross-sectional view illustrating a substrateprocessing apparatus according to another embodiment;

FIG. 5 is a schematic cross-sectional view illustrating a substrateprocessing apparatus according to another embodiment;

FIG. 6 is an enlarged view illustrating a first cover and a secondcover;

FIG. 7 is a schematic perspective view illustrating a substrateprocessing apparatus according to an embodiment;

FIG. 8 is a perspective view illustrating a chamber, an upper cover, anda lower cover of the substrate processing apparatus depicted in FIG. 7;

FIGS. 9 and 10 are views illustrating a state in which a top lid unit isseparated and lifted away from the chamber for maintenance and repair ofthe substrate processing apparatus;

FIGS. 11 and 12 are views illustrating a connection structure betweenthe top lid unit and a cylinder unit including a cylinder;

FIG. 13 is a view illustrating a state in which a top lid plate andshowerhead plate are lifted together;

FIG. 14 is a view illustrating a state in which only the showerheadplate is lifted;

FIG. 15 is a flowchart illustrating a method of maintaining andrepairing a substrate processing apparatus according to an embodiment;and

FIGS. 16 and 17 are flowcharts illustrating methods of maintaining andrepairing a substrate processing apparatus according to otherembodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings, wherein like referencenumerals refer to like elements throughout. In this regard, the presentembodiments may have different forms and should not be construed asbeing limited to the descriptions set forth herein. Accordingly, theembodiments are merely described below, by referring to the figures, toexplain aspects of the present description. Expressions such as “atleast one of,” when preceding a list of elements, modify the entire listof elements and do not modify the individual elements of the list.

Embodiments will now be described with reference to the accompanyingdrawings.

The inventive concept may, however, be embodied in many different formsand should not be construed as being limited to the embodiments setforth herein; rather, these embodiments are provided to give a clearunderstanding of the inventive concept to those of ordinary skill in theart. That is, the embodiments are provided so that this disclosure willbe thorough and complete, and will fully convey the inventive concept tothose of ordinary skill in the art.

In the following description, terms are used only for explainingspecific embodiments while not limiting the inventive concept. The termsof a singular form may include plural forms unless referred to thecontrary. The meaning of “comprise” and/or “comprising” specifies ashape, a fixed number, a step, a process, a member, an element, and/or acombination thereof but does not exclude other shapes, fixed numbers,steps, processes, members, elements, and/or combinations thereof. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various members, regions, and/or elements,these members, regions, and/or elements should not be limited by theseterms. These terms are not used to denote a particular order, apositional relationship, or ratings of members, regions, or elements,but are only used to distinguish one member, region, or element fromanother member, region, or element. Thus, a first member, region, orelement discussed below could be termed a second member, region, orelement without departing from the teachings of the inventive concept.

Hereinafter, embodiments will be described with reference to theaccompanying drawing. Shapes illustrated in the drawings may be variedaccording to various factors such as manufacturing methods and/ortolerances. That is, the embodiments are not limited to particularshapes illustrated in the drawings. Factors such as shape changes inmanufacturing processes should be considered.

FIG. 1 is a schematic cross-sectional view illustrating a substrateprocessing apparatus according to an embodiment.

Referring to FIG. 1, the substrate processing apparatus may include achamber 100, a first cover 110, a second cover 120, and a lifting device130. The lifting device 130 may be included in the chamber 100.

The chamber 100 provides spaces in which process target objects such assubstrates are processed. For example, the chamber 100 may include afirst sub-chamber 101 and a second sub-chamber 102. The chamber 100 mayhave a transfer function, a vacuum sealing function, a heating function,an exhaust function, and/or other processing functions so as to processtarget objects. In addition, the chamber 100 may provide spaces in whicha heating process, a deposition process, an etching process, a polishingprocess, an ion implanting process, and/or other processing processesare performed on process target object.

The first cover 110 may be placed on the chamber 100 to cover thechamber 100 and may include processing units 115. The processing units115 may be mechanically connected to the first cover 110 and may includefunctional members according to the function of the chamber 100. Forexample, if the chamber 100 has a deposition function, the processingunits 115 of the first cover 110 may include reactant supply units (forexample, showerhead assemblies). In another embodiment, if the chamber100 has a polishing function, the processing units 115 of the firstcover 110 may include polishing pads.

The second cover 120 may be placed between the first cover 110 and thechamber 100. The second cover 120 may provide spaces for accommodatingthe processing units 115 connected to the first cover 110.Alternatively, the second cover 120 may provide spaces for processingtarget objects. For example, if the chamber 100 performs a depositionfunction, reaction spaces or exhaust paths may be formed in the secondcover 120.

The lifting device 130 may be configured to lift the first cover 110and/or the second cover 120. For example, the lifting device 130 may beconnected to the first cover 110 to raise and lower the first cover 110.Connection regions C may be formed in the lifting device 130 and/or thesecond cover 120. If the lifting device 130 and the second cover 120 areconnected to each other via the connection regions C, the second cover120 may be lifted as the first cover 110 is lifted by the lifting device130. However, if the lifting device 130 and the second cover 120 are notconnected to each other, the second cover 120 may be in contact with thechamber 100 while the first cover 110 is lifted by the lifting device130.

Although FIG. 1 illustrates that the connection regions C are formed inboth of the second cover 120 and the lifting device 130, a connectionregion C may be formed in only one of the second cover 120 and thelifting device 130. In addition, the connection between the second cover120 and the lifting device 130 via the connection regions C is notlimited to mechanical connection. For example, the second cover 120 andthe lifting device 130 may be connected to each other usingelectromagnetic force.

The substrate processing apparatus of the embodiment is a batch typesubstrate processing apparatus capable of simultaneously processing aplurality of substrates. For example, the substrate processing apparatusmay be a horizontal batch type substrate processing apparatus. In thecase of a horizontal batch type substrate processing apparatusconfigured to process a plurality of substrates, the number ofprocessing modules (that is, the cross sectional area of the substrateprocessing apparatus) is proportional to the areas of substrates to beprocessed at a time, and thus the substrate processing apparatus may beinevitably heavy. For example, a top lid of the substrate processingapparatus may be inevitably heavy. Therefore, when the substrateprocessing apparatus is designed, an effective maintenance/repair timemanagement method may have to be considered so as to address safetyissues and improve or maintain productivity.

According to the inventive concept by taking such situations and issuesinto consideration, a method and apparatus for selectively lifting thefirst cover 110 and the second cover 120 according to the purpose andsubject of maintenance and repair may be provided.

FIGS. 2 and 3 are views illustrating the substrate processing apparatusof FIG. 1 when the first cover 110 and/or the second cover 120 are/islifted.

FIG. 2 illustrates the case in which the lifting device 130 and thesecond cover 120 are not connected to each other. While the first cover110 is lifted by a lifting action of the lifting device 130 connected tothe first cover 110, the second cover 120 is in contact with the chamber100. In this case, a maintenance/repair worker may perform amaintenance/repair operation on a lower surface of the first cover 110(for example, the processing units 115) and an upper surface of thesecond cover 120.

FIG. 3 illustrates the case in which the lifting device 130 and thesecond cover 120 are connected to each other via the connection regionsC. Since the lifting device 130 and the second cover 120 are connectedto each other, while the first cover 110 is lifted by a lifting actionof the lifting device 130, the second cover 120 is also lifted. In thiscase, a maintenance/repair worker may perform a maintenance/repairoperation on a lower surface of the second cover 120 and an uppersurface of the chamber 100.

As described above, according to the embodiment, the first cover 110and/or the second cover 120 may be selectively lifted according to thepurpose or subject of maintenance/repair. Therefore, amaintenance/repair operation may be effectively and safely performed onthe substrate processing apparatus, and a maintenance/repair time and ashut down time of the substrate processing apparatus may be reduced.

FIG. 4 is a schematic cross-sectional view illustrating a substrateprocessing apparatus according to another embodiment. The substrateprocessing apparatus of the current embodiment may be a modification ofthe substrate processing apparatus of the previous embodiment. Thus, thesame description as that presented in the previous embodiment will notbe presented here.

Referring to FIG. 4, the substrate processing apparatus may be ahorizontal batch type substrate processing apparatus capable ofsimultaneously processing a plurality of substrates. That is, aplurality of substrates arranged in a horizontal direction may besimultaneously processed. In this case, the weight of a first cover 110and/or the weight of a second cover 120 may increase in proportion tothe number of substrates to be processed at a time.

For example, if the substrate processing apparatus is a horizontal batchtype substrate processing apparatus configured to simultaneouslyprocessing two substrates, two showerhead assemblies 115′ may bearranged in the first cover 110, and thus the weight of the first cover110 may be twice the weight of a first cover of a deposition apparatuswith a single showerhead assembly configured to process a singlesubstrate at a time.

Similarly, if the substrate processing apparatus is a horizontal batchtype substrate processing apparatus configured to simultaneouslyprocessing four substrates, four showerhead assemblies may be arrangedin the first cover 110, and thus the weight of the first cover 110 maybe four times the weight of a first cover of a deposition apparatus witha single showerhead assembly configured to process a single substrate ata time. In addition, if the substrate processing apparatus includes sixor more showerhead assemblies, the weight of the first cover 110 may besix or more times the weight of a first cover of a substrate processingapparatus with a single showerhead assembly configured to process asingle substrate at a time.

Due to this reason, a plurality of lifting devices 130-1 and 130-2 maybe connected to the first cover 110. In FIG. 4, two lifting devices130-1 and 130-2 are connected to the first cover 110. However, theinventive concept is not limited thereto.

In some embodiments, reaction walls W may be formed in the second cover120. That is, as illustrated in FIG. 4, substrate holders Saccommodating process target objects such as substrates may be lifted tothe reaction walls W such that the reaction walls W may be face-sealed.Thus, reaction spaces may be formed by the two showerhead assemblies115′ connected to the first cover 110, the reaction walls W of thesecond cover 120, and the substrate holders S.

Connection regions C may be formed between the first cover 110 and thesecond cover 120. That is, in a first mode (a mode in which only thefirst cover 110 is lifted), the connection regions C between the firstcover 110 and the second cover 120 may not be connected to each other,and thus only the first cover 110 may be lifted by the lifting devices130-1 and 103-2. However, in a second mode (a mode in which both thefirst cover 110 and the second cover 120 are lifted), the first cover110 and the second cover 120 may be physically connected to each othervia the connection regions C, and thus both the first cover 110 and thesecond cover 120 connected to the first cover 110 may be lifted by thelifting devices 130-1 and 130-2.

The connection regions C may be used to enhance sealing between thefirst cover 110 and the second cover 120. That is, as the first cover110 and the second cover 120 are connected to each other via theconnection regions C, the reaction spaces formed by the first cover 110,the second cover 120, and the substrate holders S may be more securelysealed.

Although FIG. 4 illustrates that the connection regions C are formed inboth of the first cover 110 and the second cover 120, the connectionregions C may be formed in only one of the first cover 110 and thesecond cover 120. In addition, the connection between the first cover110 and the second cover 120 via the connection regions C is not limitedto mechanical connection. For example, the first cover 110 and thesecond cover 120 may be connected to each other using electromagneticforce.

Although FIG. 4 illustrates that the connection regions C are formed inthe first cover 110 and the second cover 120, the connection regions Cmay be formed in other elements. For example, the substrate processingapparatus may further include a first supporting part connected to thefirst cover 110 and a second supporting part connected to the secondcover 120, and a connection region C may be formed in at least one ofthe first and second supporting parts.

For example, the first supporting part may be provided on the outside ofthe first cover 110 in connection with the first cover 110 and mayinclude a first region, and the second supporting part may be providedon the outside of the second cover 120 in connection with the secondcover 120 and may include a second region (refer to FIGS. 9 to 14). Thefirst and second regions may correspond to the connection regions C.

If an insertion member is inserted in the first and second regions, boththe first and second covers 110 and 120 may be lifted by a liftingaction of the lifting devices 130-1 and 130-2. However, if the insertionmember is not inserted in the first and second regions, since thelifting device 130 is connected to only the first cover 110, only thefirst cover 110 may be lifted by a lifting action of the lifting device130.

FIG. 5 is a schematic cross-sectional view illustrating a substrateprocessing apparatus according to another embodiment. The substrateprocessing apparatus of the current embodiment may be a modification ofthe substrate processing apparatuses of the previous embodiments. Thus,the same description as that presented in the previous embodiments willnot be presented here.

Optionally, a connection region may be formed in a chamber 100 inaddition to a first cover 110 and a second cover 120. For example, thechamber 100 may be comprised of an upper chamber and a lower chamber. Inthis case, a connection region may be formed between the upper chamberand a cover (e.g. the second cover 120) to selectively separate theupper chamber and the lower chamber from each other.

Referring to FIG. 5, the first and second covers 110 and 120 placed onthe chamber 100 may form reaction spaces together with substrate holdersS. For example, lower portions of the reaction spaces may be defined bythe substrate holders S, upper portions of the reaction spaces may bedefined by the first cover 110, and lateral portions of the reactionspaces may be defined by the second cover 120.

If the substrate processing apparatus is a deposition apparatus, thefirst cover 110 may include showerhead assemblies. The second cover 120may include reaction walls W (refer to FIG. 6) and exhaust paths E(refer to FIG. 6). Example structures of the first and second covers 110and 120 are illustrated in FIG. 6.

Referring to FIG. 6, the deposition apparatus may have a downstreamexhaust structure. In this case, the downstream exhaust structure may beprovided by the second cover 120. In this case, a deposition gas may besprayed on process target objects through the showerhead assemblies ofthe first cover 110 and may be discharged through the exhaust paths E ofthe second cover 120 by a downstream exhaust method.

FIG. 7 is a schematic perspective view illustrating a substrateprocessing apparatus 1 according to another embodiment, and FIG. 8 is aperspective view illustrating a chamber, an upper cover, and a lowercover of the substrate processing apparatus 1. The substrate processingapparatus 1 of the current embodiment may be a modification of thesubstrate processing apparatuses of the previous embodiments. Thus, thesame description as that presented in the previous embodiments will notbe presented here.

Referring to FIGS. 7 and 8, the substrate processing apparatus 1 mayinclude: a frame 2; the chamber including a lower chamber 3 and a toplid unit 4; and cylinder units 7. The cylinder units 7 may be parts oflifting devices.

The lower chamber 3 may be supported by the frame 2. The top lid unit 4may be placed on an upper end of the lower chamber 3 and may include ashowerhead plate 5 and a top lid plate 8. At least two gas supply units6 may be arranged in the showerhead plate 5. The top lid plate 8 maydefine lateral portions of reaction spaces or may form exhaust paths.

The gas supply units 6 may include gas supply devices and may form aplurality of reaction spaces (not shown) together with at least twocorresponding lower substrate mounting units (not shown). The gas supplyunits 6 may be connected to gas supply lines connected to a gas sourceprovided outside the chamber, and thus gas may be supplied to thereaction spaces through the gas supply units 6.

The gas supply units 6 may be showerheads configured to supply gas tosubstrates in a vertical direction. In another embodiment, the gassupply units 6 may be lateral-flow devices configured to supply gas in ahorizontal direction. In another embodiment, the gas supply units 6 maybe any devices capable of supplying gas to the reaction spaces.

A gate (not shown) may be formed in a lateral side of the lower chamber3 to allow supply and discharge of substrates, and the gate may beconnected to a substrate transfer unit (not shown). A plurality ofsubstrates may be simultaneously or sequentially transferred to thelower chamber 3 through the gate. Then, the substrates may be loaded onthe substrate mounting units (not shown) located under the gas supplyunits 6 and may be unloaded from the substrate mounting units.

According to the embodiment, the substrate processing apparatus 1configured as a batch type (for example, a horizontal batch type)substrate processing apparatus includes the substrate mounting unitscorresponding to the gas supply units 6. Therefore, a plurality ofsubstrates may be processed in the reaction spaces.

Substrates may be transferred into the chamber through the gate by atransfer arm (not shown) of the substrate transfer unit and may then beloaded in the substrate mounting units respectively corresponding to thegas supply units 6. When the substrates are loaded in the substratemounting units, an additional rotation arm (not shown) installed at acenter portion of the chamber, between the substrate mounting units mayreceive the substrates from the transfer arm of the substrate transferunit and may respectively load the substrates to the substrate mountingunits. Alternatively, the rotation arm may not be provided, and thetransfer arm of the substrate transfer unit may directly load/unload thesubstrates to the substrate mounting units. For example, Korean PatentNo. 10-782529 discloses a chamber including a plurality of reactors, androtation arms installed in the chamber between the reactors.

Referring to FIG. 7, the cylinder units 7 are provided on lateral sidesof a chamber body of the chamber. In the embodiment, two cylinder units7 are placed around the center of the chamber in a diagonal direction.However, if the top lid unit 4 is heavy, two additional cylinder unitsmay be placed in another diagonal direction. That is, four cylinderunits may be provided. On the contrary, if the top lid unit 4 is notheavy, only one cylinder unit may be provided.

Cylinders of the cylinder units 7 may be moved upward and downward byair or hydraulic pressure. In some embodiments, the cylinders may bemoved upward and downward using the elasticity of springs. In addition,the cylinders may include any other devices for vertical operation.

As described above, the showerhead plate 5 includes the gas supply units6. Thus, the showerhead plate 5 including the gas supply units 6 may beconsiderably heavy. Therefore, when a maintenance/repair worker liftsthe top lid unit 4 (that is, when the lower chamber 3 and reactorsarranged inside the lower chamber 3 are exposed to the outside), asafety device may be necessary to support the top lid unit 4 and preventfalling of the top lid unit 4. In such a situation, the cylinder units 7may support the top lid unit 4 to prevent falling of the top lid unit 4.

The frame 2 may include fixing members (not shown) for connection withthe cylinder units 7. In some embodiments, the frame 2 and the cylinderunits 7 may be provided in one piece.

FIG. 8 illustrates a state in which the top lid unit 4 including the gassupply units 6 is coupled to the lower chamber 3. In general substrateprocessing processes (such as a deposition process or an etchingprocess), the lower chamber 3 and the top lid unit 4 are in the stateillustrated in FIG. 8.

FIG. 9 illustrates a state in which the top lid unit 4 is lifted awayfrom the lower chamber 3 for maintenance/repair work. The cylinder units7 of the lifting devices may be used to lift the top lid unit 4.

FIG. 10 illustrates a state in which the top lid unit 4 is lifted awayfrom the lower chamber 3. However, unlike the state shown in FIG. 9, thetop lid unit 4 is separated into the showerhead plate 5 and the top lidplate 8, and only the showerhead plate 5 is lifted in a state in whichthe top lid plate 8 is coupled to the lower chamber 3.

The showerhead plate 5 and the top lid plate 8 may constitute the toplid unit 4 and may be selectively separated from each other using thecylinder units 7. Therefore, the showerhead plate 5 may be separated toperform a maintenance/repair operation on the showerhead plate 5, orboth the top lid plate 8 and the showerhead plate 5 may be lifted toperform a maintenance/repair operation on the lower chamber 3.

For example, when it is required to replace showerheads (not shown)arranged in the showerhead plate 5 or to repair the gas supply units 6connected to the showerheads, only the showerhead plate 5 may be liftedinstead of lifting both the showerhead plate 5 and the top lid plate 8.In addition, when it is required to perform a maintenance/repairoperation on the inside of the lower chamber 3 (for example, on therotation arm or the substrate mounting units), both the showerhead plate5 and the top lid plate 8 may be lifted to perform a maintenance/repairoperation on the inside of the lower chamber 3.

As described above, according to the embodiment, the showerhead plate 5and the top lid plate 8 of the top lid unit 4 may be selectivelyseparated from each other, and thus the substrate processing apparatus 1may be more efficiently maintained and repaired.

FIGS. 11 and 12 illustrate an example connection structure between thetop lid unit 4 and a cylinder unit 7 including a cylinder 9.

Referring to FIGS. 11 and 12, the substrate processing apparatus 1 mayfurther include a showerhead plate supporting block 11 and at least onetop lid plate supporting block 12.

The showerhead plate supporting block 11 may be mechanically connectedto the showerhead plate 5 (for example, using fasteners such as screws).In some embodiments, the showerhead plate supporting block 11 and theshowerhead plate 5 may be formed in one body. Similarly, the top lidplate supporting block 12 and the top lid plate 8 may be formed in onebody or may be mechanically coupled to each other.

The showerhead plate supporting block 11 may be connected between theshowerhead plate 5 and the cylinder 9. That is, an upper portion of thecylinder 9 may be formed in one body with or may be mechanicallyconnected to a lower portion of the showerhead plate supporting block11. Therefore, when the cylinder 9 is lifted by, for example, airpressure, the showerhead plate 5 coupled to or formed in one body withthe showerhead plate supporting block 11 may be lifted.

On the contrary, the top lid plate supporting block 12 and the top lidplate 8 coupled to the top lid plate supporting block 12 are physicallyseparate from the cylinder 9, and thus the top lid plate supportingblock 12 and the top lid plate 8 are not lifted when the cylinder 9 islifted.

Referring to FIG. 12, insertion regions 13 may be formed between bothlateral sides of the showerhead plate supporting block 11 and the toplid plate supporting block 12 to receive inserts 10. If the inserts 10are inserted into the insertion regions 13, the showerhead platesupporting block 11 and the top lid plate supporting block 12 may bemechanically fixed to each other by the inserts 10. Therefore, when thecylinder 9 is lifted, both the top lid plate 8 and the showerhead plate5 may be simultaneously lifted.

FIG. 13 illustrates a state in which the top lid plate 8 and theshowerhead plate 5 are lifted together, and FIG. 14 illustrates a statein which only the showerhead plate 5 is lifted.

Referring to FIG. 13, if the inserts 10 are inserted into the insertionregions 13 between the top lid plate supporting block 12 and theshowerhead plate supporting block 11, the top lid plate 8 and theshowerhead plate 5 are lifted together. However, as illustrated in FIG.14, if the inserts 10 are not inserted, only the showerhead plate 5 islifted. As described above, according to the embodiment, the top lidunit 4 may be selectively lifted according to the purpose ofmaintenance/repair work.

At least one insertion region may be formed between the showerhead platesupporting block 11 and the top lid plate supporting block 12. Forexample, as illustrated in FIG. 12, two insertion regions 13 may beformed, and the inserts 10 may be inserted into the insertion regions13. Each of the insertion regions 13 may include a first insertionregion I1 formed in each of the top lid plate supporting block 12 and asecond insertion region I2 formed in the showerhead plate supportingblock 11.

Each of the inserts 10 may have a cross section in which a first portionextending in a vertical direction meets a second portion extending in ahorizontal direction at a right angle (that is, an L-shaped crosssection). The first portions of the inserts 10 may be inserted into thefirst insertion regions I1 formed in the top lid plate supporting block12, and the second portions of the inserts 10 may be inserted into thesecond insertion regions I2 formed in the showerhead plate supportingblock 11. In the embodiment, it is described that the first portionsextend in a vertical direction, and the second portions extend in ahorizontal direction. However, the inventive concept is not limitedthereto. That is, the first portions may extend in any direction such asa horizontal direction, and the second portions may extend in adirection different from the direction in which the first portionsextend.

In some embodiments, the cross sections of the inserts 10 may furtherinclude third portions extending from the second portions (for example,at right angles) in addition to the first and second portions. The thirdportions may be shorter than the second portions, and thus the inserts10 may have J-shaped cross sections. The third portions of the inserts10 may be inserted into the second insertion regions 12 formed in theshowerhead plate supporting block 11. That is, the second insertionregions 12 of the showerhead plate supporting block 11 may have anL-shape, and the second and third portions of the inserts 10 may beinserted into the second insertion regions 12 having an L-shape. Thisstructure may improve mechanical contact between the top lid platesupporting block 12, the inserts 10, and the showerhead plate supportingblock 11.

In other embodiments, the inserts 10 may include first openings 01 andsecond openings 02. The first openings 01 of the inserts 10 may beconnected to openings 0 of the top lid plate supporting block 12 usingfasteners such as screws, and thus the inserts 10 and the top lid platesupporting block 12 may be more securely fixed to each other. Inaddition, the second openings 02 of the inserts 10 may be connected toopenings (not shown) of the top lid plate 8 using fasteners such asscrews, and thus the inserts 10 and the top lid plate 8 may be moresecurely fixed to each other.

FIG. 15 is a flowchart illustrating a method of maintaining andrepairing a substrate processing apparatus according to an embodiment.

Referring to FIG. 15, in a first operation S1510, the inside pressure ofa chamber is increased to a level equal to the outside pressure of thechamber. Before the substrate processing apparatus is dissembled toperform a maintenance/repair operation after a process such as adeposition, etching, or cleaning process is performed using thesubstrate processing apparatus, the inside and outside pressures of thesubstrate processing apparatus may be balanced by increasing the insidepressure of the substrate processing apparatus to a level equal to theoutside pressure of the substrate processing apparatus.

Thereafter, in a second operation S1520, the substrate processingapparatus may be dissembled by lifting at least one of first and secondcovers arranged on the chamber. Such a dissembling operation may beperformed using a lifting device (for example, a cylinder using airpressure, hydraulic pressure, and/or elastic force).

During the second operation S1520, at least one of the first and secondcovers may be selectively lifted depending on whether the first andsecond covers are physically coupled to each other (or the first andsecond covers are separate from each other). For example, if the firstand second covers are separate from each other (a first mode), only thefirst cover may be lifted during the second operation S1520, and thesecond cover may be maintained in contact with the chamber (operationS1523).

If the first and second covers are coupled to each other (a secondmode), both the first and second covers may be lifted during the secondoperation S1520 (operation S1525). When the lifting device and thesecond cover or the first and second covers are in connection with eachother via connection regions as described above, the second operationS1520 may be performed in the second mode.

After the second operation S1520, a maintenance/repair operation may beperformed on the substrate processing apparatus (operation S1530). Asdescribed above, at least one of the first and second covers may beselectively lifted, and thus the first cover, the second cover, and/orthe chamber may be selectively maintained and repaired.

FIGS. 16 and 17 are flowcharts illustrating methods of maintaining andrepairing a substrate processing apparatus according to otherembodiments. The maintaining and repairing methods of the embodimentsmay be modifications of the maintaining and repairing method of theprevious embodiment. Thus, the same description as that presented in theprevious embodiment will not be presented here.

In the embodiment illustrated in FIG. 16, inserts are inserted such thata first cover (for example, a showerhead plate) and a second cover (forexample, a top lid plate) may be lifted together. First, the insidepressure of a chamber is increased to a level equal to the outsidepressure of the chamber (operation S1610). Thereafter, the inserts areinserted into insertion regions formed between a showerhead platesupporting block and at least one top lid plate supporting block(operation S1620). Therefore, the showerhead plate supporting block andthe top lid plate supporting block may be physically fixed. Thereafter,if a cylinder connected to the showerhead plate supporting block islifted (operation S1630), the showerhead plate and the top lid plate maybe lifted together (operation S1640).

In the embodiment illustrated in FIG. 17, the inserts are not inserted,and only the showerhead plate is lifted. First, the inside pressure ofthe chamber is increased to a level equal to the outside pressure of thechamber (operation S1710). Thereafter, the inserts are not inserted intothe insertion regions formed between the showerhead plate supportingblock and the top lid plate supporting block (operation S1720). Sincethe showerhead plate supporting block and the top lid plate supportingblock are separate from each other, if the cylinder connected to theshowerhead plate supporting block is lifted (operation S1730), only theshowerhead plate may be lifted (operation S1740).

As described above, according to the substrate processing apparatus andthe maintaining and repairing method of the one or more of the aboveembodiments, the top lid unit including the showerhead plate and the toplid plate may be selectively lifted according to the purpose ofmaintenance and repair work, and thus the substrate processing apparatusmay be more efficiently and safely maintained and repaired. In addition,a maintenance/repair time and a shut down time of the substrateprocessing apparatus may be reduced, and thus the productivity of thesubstrate processing apparatus may be improved.

It should be understood that embodiments described herein should beconsidered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each embodimentshould typically be considered as available for other similar featuresor aspects in other embodiments.

While one or more embodiments have been described with reference to thefigures, it will be understood by those of ordinary skill in the artthat various changes in form and details may be made therein withoutdeparting from the spirit and scope of the inventive concept as definedby the following claims.

What is claimed is:
 1. A substrate processing apparatus comprising: a chamber; a first cover and a second cover on the chamber; a lifting device connected to the first cover and configured to raise and lower the first cover; a connection region including a concave region; a first supporting part connected to the first cover; and a second supporting part connected to the second cover, wherein when the lifting device and the second cover are connected to each other via the connection region, the first and second covers are raised and lowered by the lifting device, wherein, when an insertion member is not inserted into the connection region, only the first cover is raised and lowered by the lifting device, wherein, when the insertion member is inserted into the connection region, the first cover and the second cover are mechanically connected to each other by the insertion member, and the first and second covers are simultaneously raised and lowered by the lifting device and the insertion member, and wherein, when the insertion member is inserted into the connection region and the lifting device lifts, an upper surface of the insertion member contacts with the first supporting part and the second supporting part to push up the second cover, wherein the insertion member includes: a first portion extending in a first direction; a second portion extending in a second direction different from the first direction; and a third portion extending from the second portion and extending in a third direction different from the second direction, wherein, when the insertion member is inserted into the connection region, the third portion of the insertion member is accommodated in the concave region of the connection region, wherein the insertion member includes a first opening and a second opening, wherein the first opening is connected to an opening of the second supporting part using a fastener, and wherein the second opening is connected to an opening of the second cover using a fastener.
 2. The substrate processing apparatus of claim 1, wherein the substrate processing apparatus is a horizontal batch type substrate processing apparatus capable of simultaneously processing a plurality of substrates, and at least one of the first cover and the second cover comprises a plurality of accommodation regions accommodating the plurality of substrates.
 3. The substrate processing apparatus of claim 1, wherein the connection region is formed in at least one of the first and second supporting parts.
 4. The substrate processing apparatus of claim 3, wherein the connection region is formed by a first region of the first supporting part and a second region of the second supporting part.
 5. The substrate processing apparatus of claim 1, wherein the first portion is inserted into a first insertion region formed in the second supporting part, wherein the second portion is inserted into a second insertion region formed in the first supporting part, wherein the first opening extends in a fourth direction through the first portion, and wherein the second opening extends in a fifth direction different from the fourth direction through the second portion.
 6. The substrate processing apparatus of claim 1, wherein the first cover comprises a processing unit.
 7. The substrate processing apparatus of claim 1, wherein the second cover comprises a reaction wall.
 8. The substrate processing apparatus of claim 7, wherein the second cover further comprises an exhaust path.
 9. The substrate processing apparatus of claim 1, when the insertion member is inserted into the connection region and the lifting device lifts, the first supporting part at least makes a first contact with lower and side surfaces of the insertion member and the second supporting unit at least makes a second contact with the upper surface of the insertion member, and thus an upward force of the lifting device is transferred to the second supporting part through the first contact and the second contact.
 10. A substrate processing apparatus comprising: a frame; a chamber disposed on the frame; wherein the chamber comprises: a lower chamber comprising at least one substrate mounting unit, a top lid unit comprising a showerhead plate and a top lid plate, wherein gas supply units are arranged in the showerhead plate; at least one lifting device connected to the top lid unit, a showerhead plate supporting block connected between the showerhead plate and the lifting device; and a top lid plate supporting block connected to the top lid plate, wherein at least two insertion regions are formed between the showerhead plate supporting block and the top lid plate supporting block, each of the insertion regions including a concave region, wherein, when inserts are not inserted into the insertion regions, only the showerhead plate is raised and lowered by the lifting device, and wherein, when the inserts are inserted into the insertion regions, the showerhead plate and the top lid plate are mechanically connected to each other by the inserts, and the showerhead plate and the top lid plate are simultaneously raised and lowered by the lifting device and the inserts, wherein, when the inserts are inserted into the insertion regions and the lifting device lifts, an upper surface of each of the inserts contacts with the showerhead plate supporting block and the top lid plate supporting block to push up the top lid plate, wherein each of the inserts includes: a first portion extending in a first direction; a second portion extending in a second direction different from the first direction; and a third portion extending from the second portion and extending in a third direction different from the second direction, wherein, when the inserts are inserted into the insertion regions, the third portion of each of the inserts is accommodated in the concave region of each of the insertion regions, wherein each of the inserts include a first opening and a second opening, wherein the first opening is connected to an opening of the top lid plate supporting block using a fastener, wherein the second opening is connected to an opening of the top lid plate using a fastener, and wherein the first opening and the second opening extend in different directions.
 11. The substrate processing apparatus of claim 10, wherein the inserts are inserted into the insertion regions.
 12. The substrate processing apparatus of claim 11, wherein the top lid plate is coupled to the lifting device through the inserts.
 13. The substrate processing apparatus of claim 10, wherein the first portion is inserted into a first insertion region formed in the top lid plate supporting block, and wherein the second portion is inserted into a second insertion region formed in the showerhead plate supporting block.
 14. The substrate processing apparatus of claim 13, wherein the third portion is inserted into the second insertion region of the showerhead plate supporting block.
 15. The substrate processing apparatus of claim 14, wherein the third portion is shorter than the second portion, and thus the insert has a J-shaped cross section.
 16. The substrate processing apparatus of claim 10, wherein the lifting device comprises a cylinder.
 17. The substrate processing apparatus of claim 16, wherein the cylinder is configured to lift the top lid unit using air pressure, hydraulic pressure, or elastic force.
 18. The substrate processing apparatus of claim 10, wherein, when inserts are inserted into the insertion regions and the lifting device lifts, the showerhead plate supporting block at least makes a first contact with lower and side surfaces of each of the inserts and the top lid plate supporting block at least makes a second contact with the upper surface of each of the inserts, and thus an upward force of the lifting device is transferred to the top lid plate supporting block through the first contact and the second contact. 